Greetings from Tohoku University, Japan!
We are pleased to announce that Tohoku University Engineering Short Program (TESP) Winter 2026 applications are now open for Universitas Gadjah Mada with Limited Quota.
Tohoku University is a leading national university in Japan, renowned for its academic excellence, world-class research, and strong commitment to international education and collaboration. Established in 1907, the university has developed a distinctive academic tradition based on the principles of “Research First,” “Open Doors,” and “Practice-Oriented Research and Education.”
Tohoku University Engineering Short Program (TESP) Winter 2026 is an intensive international program that combines research experience in Tohoku University laboratories with entrepreneurship-oriented, project-based learning. Participants work in multicultural teams to explore real-world social challenges, develop value propositions, consider implementation pathways, and connect specialized knowledge gained through laboratory activities to possible solutions for society. The overarching challenge for TESP Winter 2026 is “Resilient Essential Systems.” Participants explore how science and engineering can contribute to making the systems that support everyday life and society more resilient to disruption and change.
The program also includes field trips, Japanese cultural experiences, and opportunities to interact with Tohoku University students. Through these activities, TESP aims to foster engineers and deep-tech talent who can work across disciplines and cultures and translate research-based knowledge into social value.
TESP Winter 2026 is organized by the School of Engineering, Tohoku University, with cooperation from the International Research Institute of Disaster Science and the Semiconductor Creativity Hub.
PROGRAM OVERVIEW:
Program Overview
- Program Dates: December 3 (Thu) – December 18 (Fri), 2026
- Location: Aobamaya Campus, Tohoku University (Sendai, Japan)
- Target: Undergraduate, Master’s students from overseas universities
- Key Components:
- Entrepreneurship Module: Step-by-step PBL from problem identification to pitch presentation.
- Laboratory Activity Module: Research activities within assigned host laboratories.
- Field Trips & Cultural Experiences: Excursions and Japanese culture/language session.
- Program Fee: JPY 110,000 per student (The fee covers tuition, experimental materials, cultural and social activities, field trip, and cafeteria vouchers. Participants are responsible for their own accommodation, local transportation, airfare, and insurance)
- Language: English
- Evaluation: The coursework and laboratory activities, including an oral presentation, are equivalent to 4 ECTS credits. A certificate of completion will be awarded to all participants who successfully complete the program.
- Application Deadline: September 24th (Thu), 2026 (Please also refer to the deadline for the internal review at the Faculty of Engineering UGM)
- Website : https://sites.google.com/tohoku.ac.jp/tesp/winter-program
Email : tesp-admin@grp.tohoku.ac.jp
SCHOLARSHIP AVAILABIILITY:
The JASSO Scholarship (80,000 JPY) is available for non-Japanese participants of TESP. Please note that the number of recipients is limited to a maximum of 8 students, and not all applicants will be awarded the scholarship. The scholarship will be disbursed in cash during the program period.
ELIGIBILITY:
Undergraduate (S1) or Master (S2) Students
REQUIRED DOCUMENTS:
- Official Academic Transcript
- English Language Proficiency
- Letter of Enrolment from Faculty
- Letter of Recommendation from Academic Advisor
- Curriculum Vitae, Please Write the CV according to the guidelines below:
- Academic background from high school to the present without any gaps, shown in month-level detail.
- Any blank periods should be specified, such as travel, part-time work, nursing, etc.
- Your portrait photo.
- Any CV that does not include the above items shall be considered invalid.
- Motivation Letter
- Colored Copy of Passport
- Confimation Letter of Participation (Link Drive), you may submit without the approval from the Vice Dean.
- Passport Size Photo
APPLICATION PROCEDURE:
- Submit the aforementioned documents to FT UGM Application Form: http://ugm.id/TESP2026FTUGM, Deadline for Enrollment: September 20th (Sun), 2026 (23.59 WIB) for the internal review.
- OIA Faculty of Engineering will evaluate your application. Once you are selected as Nominated Applicant, OIA Faculty of Engineering will give you letter of nomination from Faculty.
- Then, you may proceed to the official Tohoku University Online Application Form before the deadline: September 24th (Thu), 2026 (JST).
- The final decision is from Tohoku University (Selection Results: September 30th (Wed), 2026 (JST)).
CONTACT INFORMATION:
If you have any questions regarding the program, you can contact us in OIA Faculty of Engineering office hour:
WhatsApp : +62 823-2087-6159
Email : oia.ft@ugm.ac.id